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Volumn 109, Issue 9, 2011, Pages
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Material and process optimization of correlated electron random access memories
a a a,b b |
Author keywords
[No Author keywords available]
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Indexed keywords
ANNEALING TEMPERATURES;
CARBONYL LIGAND;
CHARGE-TRANSFER INSULATORS;
CHEMICAL SOLUTION DEPOSITION;
COORDINATION NUMBER;
CORRELATED ELECTRONS;
DISPROPORTIONATION REACTIONS;
DOMINANT MECHANISM;
FILM STOICHIOMETRY;
FINE TUNING;
GENERAL CLASS;
MEMORY MECHANISM;
METAL-TO-INSULATOR TRANSITIONS;
MODE OF OPERATIONS;
NIO THIN FILM;
PROCESS PARAMETERS;
RANDOM ACCESS MEMORIES;
RESISTIVE SWITCHING;
STABILIZING EFFECTS;
SURFACE EXCESS;
TRANSITION-METAL OXIDES;
ULTRA LOW TEMPERATURES;
VARIABLE RESISTANCE;
CARBONYLATION;
CHARGE TRANSFER;
COMPLEXATION;
DEPOSITION;
ELECTROFORMING;
ELECTRON-ELECTRON INTERACTIONS;
ELECTRONS;
ION EXCHANGE;
LIGANDS;
METAL INSULATOR TRANSITION;
METAL IONS;
OPTIMIZATION;
OXYGEN;
OXYGEN VACANCIES;
SEMICONDUCTOR DOPING;
STOICHIOMETRY;
THIN FILMS;
TRANSITION METAL COMPOUNDS;
TRANSITION METALS;
VAPOR DEPOSITION;
RANDOM ACCESS STORAGE;
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EID: 79959525265
PISSN: 00218979
EISSN: None
Source Type: Journal
DOI: 10.1063/1.3581197 Document Type: Conference Paper |
Times cited : (19)
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References (17)
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