Characterization of low-k benzocyclobutene dielectric thin film

Microelectronics International

Volumn 20, Issue 3, 2003, Pages 11-12

  Chan, K C ^a   Teo, M ^b   Zhong, Z W ^c  

^a MicroFab Technology (S) Pte Ltd   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Curing; Shrinkage; Thin film

Indexed keywords

AMERICAN SOCIETY FOR TESTING AND MATERIALS; BENZOCYCLOBUTENE; CURING CONDITION; CURING KINETICS; DIELECTRIC THIN FILMS; EXTENT OF CURE; FILM PROPERTIES; INTER-LAYER DIELECTRICS; LOW DIELECTRIC CONSTANTS; MICROELECTRONICS INDUSTRY; SPIN-ON; THERMAL CURING; THIN-FILM CHARACTERIZATION; VITRIFICATION POINTS; WEIGHT LOSS;

BUTENES; CHARACTERIZATION; CURING; DIELECTRIC PROPERTIES; DIFFERENTIAL SCANNING CALORIMETRY; ENGINEERING RESEARCH; FILM THICKNESS; MATERIALS TESTING; MICROELECTRONICS; REFRACTIVE INDEX; THERMODYNAMIC STABILITY; THERMOGRAVIMETRIC ANALYSIS; THIN FILMS; VITRIFICATION;

DIELECTRIC MATERIALS;

EID: 79958772863     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565360310487909     Document Type: Article

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