Packaging and assembly for integrated photonics - A review of the ePIXpack photonics packaging platform

IEEE Journal on Selected Topics in Quantum Electronics

Volumn 17, Issue 3, 2011, Pages 645-651

  Zimmermann, Lars ^a,b   Preve, Giovan Battista ^c   Tekin, Tolga ^b   Rosin, Thomas ^d   Landles, Kennedy ^e  

^a IHP   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^c UNIVERSITAT POLITÈCNICA DE VALÈNCIA   (Spain)

^d FRAUNHOFER HEINRICH HERTZ INSTITUTE   (Germany)

^e Optocap Ltd   (United Kingdom)

Author keywords

Hybrid integrated circuit packaging; photonic integration; silicon on insulator (SOI)

Indexed keywords

ACADEMIC COMMUNITY; HYBRID INTEGRATED-CIRCUIT PACKAGING; INTEGRATED PHOTONICS; PHOTONIC INTEGRATION; PHOTONICS PACKAGING; SILICON PHOTONICS; SILICON-ON-INSULATOR (SOI);

INTEGRATION; PACKAGING; PHOTONIC DEVICES; PHOTONICS;

PHOTONIC INTEGRATION TECHNOLOGY;

EID: 79958295260     PISSN: 1077260X     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSTQE.2010.2084992     Document Type: Review

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