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Volumn 7, Issue 11, 2007, Pages 3917-3919
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Electrical properties of silver paste prepared from nanoparticles and lead-free frit
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Author keywords
Lead free; Low temperature sintering; Nanoparticles; Silver paste; Thick film
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Indexed keywords
ALUMINA SUBSTRATES;
AVERAGE PARTICLE SIZE;
CHEMICAL REDUCTION METHODS;
ELECTRICAL (ELECTRONIC) PROPERTIES;
GLASS SYSTEMS;
GLASS TRANSITION TEMPERATURE (TG);
LEAD FREE;
PB-FREE;
SHEET RESISTIVITY;
SILVER NANOPARTICLES (NPS);
SILVER PASTES;
SILVER POWDERS;
ELECTRIC PROPERTIES;
FILM PREPARATION;
GLASS;
GLASS TRANSITION;
LEAD;
LEAD ALLOYS;
MIXING;
MOLECULAR BEAM EPITAXY;
NANOPARTICLES;
NANOSTRUCTURED MATERIALS;
NANOSTRUCTURES;
OPTICAL DESIGN;
POWDER METALLURGY;
POWDERS;
SILVER;
SURFACE ACTIVE AGENTS;
THICK FILMS;
PRECIOUS METALS;
GLASS;
LEAD;
NANOMATERIAL;
SILVER;
ARTICLE;
CHEMISTRY;
CONFORMATION;
CRYSTALLIZATION;
IMPEDANCE;
MACROMOLECULE;
MATERIALS TESTING;
METHODOLOGY;
NANOTECHNOLOGY;
OINTMENT;
PARTICLE SIZE;
SURFACE PROPERTY;
ULTRASTRUCTURE;
CRYSTALLIZATION;
ELECTRIC IMPEDANCE;
GLASS;
LEAD;
MACROMOLECULAR SUBSTANCES;
MATERIALS TESTING;
MOLECULAR CONFORMATION;
NANOSTRUCTURES;
NANOTECHNOLOGY;
OINTMENTS;
PARTICLE SIZE;
SILVER;
SURFACE PROPERTIES;
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EID: 38449111041
PISSN: 15334880
EISSN: None
Source Type: Journal
DOI: 10.1166/jnn.2007.059 Document Type: Conference Paper |
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Times cited : (12)
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References (8)
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