Selection of soldering temperature for ultrasonic-assisted soldering of 5056 aluminum alloy using Zn-Al system solders

Journal of Materials Processing Technology

Volumn 211, Issue 9, 2011, Pages 1534-1539

  Nagaoka, Toru ^a   Morisada, Yoshiaki ^a   Fukusumi, Masao ^a   Takemoto, Tadashi ^b  

^a OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE   (Japan)

^b OSAKA UNIVERSITY   (Japan)

Author keywords

5056 Aluminum alloy; Joint strength; Tensile strength; Ultrasonic soldering; Zn Al solder

Indexed keywords

5056 ALUMINUM ALLOY; ALUMINUM RODS; ALUMINUM SUBSTRATE; BUTT JOINTS; FAYING SURFACE; JOINT STRENGTH; LIQUIDUS TEMPERATURE; SEM-EDX; SOLDER JOINTS; SOLDER LAYERS; SOLDERING PROCESS; SOLDERING TEMPERATURE; TENSILE TESTS; ULTRASONIC SOLDERING; ULTRASONIC VIBRATION; ZN-AL SOLDER;

ALUMINUM; ALUMINUM ALLOYS; ALUMINUM METALLURGY; DISSOLUTION; SOLDERING ALLOYS; TENSILE STRENGTH; TENSILE TESTING; ULTRASONICS; ZINC; ZINC ALLOYS;

SOLDERING;

EID: 79958119232     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2011.04.004     Document Type: Article

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