Integrated MEMS switch technology on SOI-CMOS

Technical Digest - Solid-State Sensors, Actuators, and Microsystems Workshop

Volumn , Issue , 2008, Pages 18-21

  Costa, J ^a   Ivanov, T ^a   Hammond, J ^a   Gering, J ^a   Glass, E ^a   Jorgenson, J ^a   Dening, D ^a   Kerr, D ^a   Reed, J ^a   Crist, S ^a   Mercier, T ^a   Kim, S ^a   Gorisse, P ^b  

^a RF MICRO DEVICES   (United States)

^b RFMD   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS; CMOS INTEGRATED CIRCUITS; MICROSYSTEMS; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS;

CONTACT SWITCHES; DIELECTRIC ENCAPSULATION; HIGH VOLTAGE GENERATION; INTEGRATED MEMS; INTEGRATION STRATEGY; LOW-COST PACKAGING; MANAGEMENT FUNCTIONS; WAFER LEVEL PACKAGE;

SOLID-STATE SENSORS;

EID: 79957955353     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.31438/trf.hh2008.5     Document Type: Conference Paper

References (8)

1. G. Rebeiz, “RF MEMS, Theory, Design and Technology”, Chapter 1, John Wiley and Sons (2003).
2. H. de los Santos, “Micromechanical Microwave Systems:, Chapter 3, Artech House (2004).
3. H. de los Santos, Y. Kao, A. Caigoy, E. Ditmars, “Microwave and mechanical considerations in the design of MEMS switches for aerospace applications”, Proceedings of the 1997 IEEE Aerospace Conference, IEEE (1997), pp235-254.
4. W. Wolmouth, W. Liebl, V. Juneja, R. Hallgreen, W. Strubble, “E/D pHEMT technology for wireless components”, proceedings of the 2004 IEEE Compound Semiconductor Integrated Circuits Symposium, (2004), pp 115-118.
5. D. Kelly, C. Brindle, C. Kemerling, M. Suber, “The state of the art of silicon-on-sapphire CMOS RF switches”, proceedings of the IEEE Compound Semiconductor Symposium, (2005), pp 200-205.
6. J. Costa, M. Carroll, J. Jorgenson, T. Mckay, T. Ivanov, T. Dinh, D. Kozuch, G. Remoundos, D. Kerr, A. Tombak, J. Mcmacken, M. Zybura, “A silicon RFCMOS SOI Technology for integrated cellular/WLAN RF TX applications”, Proceedings of the IEEE MTS Microwave Symposium, (2007), pp(445-448).
7. L. Guan, J. Sin, H. Liu, Z. Xiong, “A Fully Integrated SOI RF MEMS technology for System-on-Chip applications”, IEEE Trans. Elec. Devices, Vol. 53, No. 1, (2006), pp 167-172.
8. A. Morris, S. Cunningham, “Challenges and Solutions for cost-effective RF-MEMS packaging”, Proceedings of the Electronic Manufacturing Technology Symposium, (2007) pp 278-285.