Optimization of piezoelectric oscillating fan-cooled heat sinks for electronics cooling

IEEE Transactions on Components and Packaging Technologies

Volumn 33, Issue 1, 2010, Pages 25-31

  Petroski, James ^a   Arik, Mehmet ^b   Gursoy, Mustafa ^c  

^a GE Lumination   (United States)

^b GE GLOBAL RESEARCH   (United States)

^c Pro Solutions USA   (United States)

Author keywords

Electronics cooling; Flow visualization; Heat sink; Piezoelectric fans; Piezofans; Volumetric coefficient of performance (COPv)

Indexed keywords

COMPUTATIONAL STUDIES; COOLING CAPABILITY; COOLING SCHEME; EFFICIENT METHOD; ELECTRONIC ASSEMBLIES; ELECTRONICS COOLING; HEAT LOADS; HEAT TRANSFER RATE; METAL BEAM; PIEZO ACTUATOR; PIEZOELECTRIC FANS; SURFACE AREA; SYSTEM CHARACTERIZATION; SYSTEM COOLING; VOLUMETRIC COEFFICIENTS;

COOLING; FLOW FIELDS; FLOW VISUALIZATION; HEAT CONVECTION; HEAT SINKS; PIEZOELECTRICITY; THREE DIMENSIONAL;

FANS;

EID: 77949569561     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2009.2023859     Document Type: Article

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