Accurate modeling of substrate coupling for substrates without grounded backplates

Proceedings - IEEE International SOC Conference, SOCC 2003

Volumn , Issue , 2003, Pages 281-282

  Su, Q ^a   Massoud, Y ^a   Kawa, J ^a   Chiang, C ^a  

^a SYNOPSYS INC   (United States)

Author keywords

Admittance; Aging; Boundary element methods; Distributed computing; Finite difference methods; Grounding; Packaging; Permission; Very large scale integration; Voltage

Indexed keywords

AGING OF MATERIALS; BOUNDARY ELEMENT METHOD; CHIP SCALE PACKAGES; DISTRIBUTED COMPUTER SYSTEMS; ELECTRIC ADMITTANCE; ELECTRIC GROUNDING; ELECTRIC POTENTIAL; FINITE DIFFERENCE METHOD; PACKAGING; VLSI CIRCUITS;

ACCURATE MODELING; BACKPLATES; FLOATING SUBSTRATE; PERMISSION; RESISTIVE COUPLINGS; SUBSTRATE COUPLINGS;

SUBSTRATES;

EID: 79956143885     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SOC.2003.1241521     Document Type: Conference Paper

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