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Materials Chemistry and Physics

Volumn 128, Issue 1-2, 2011, Pages 114-120

Fabrication, thermal and electrical properties of polyphenylene sulphide/copper composites

(6) Goyal, R K a Kambale, K R a Nene, S S a Selukar, B S b Arbuj, S c Mulik, U P c

a Department of Instrumentation & Control Engineering (India)

b NATIONAL CHEMICAL LABORATORY (India)

c CENTRE FOR MATERIALS FOR ELECTRONICS TECHNOLOGY C MET (India)

Author keywords

Dielectric property; Electrical conductivity; Hardness; Thermal expansion

Indexed keywords

CHAR YIELD; DIELECTRIC CONSTANTS; DISSIPATION FACTORS; ELECTRICAL CONDUCTIVITY; ELECTRICAL PROPERTY; ELECTRONIC APPLICATION; MATRIX; ORDERS OF MAGNITUDE; PERCOLATION THRESHOLDS; POLYPHENYLENE SULPHIDE; RULE OF MIXTURE; SCANNING ELECTRON MICROSCOPE; THERMAL STABILITY; TRANSITION COEFFICIENT; UNIFORM DISTRIBUTION;

DIELECTRIC PROPERTIES OF SOLIDS; DIMENSIONAL STABILITY; ELECTRIC CONDUCTIVITY; GLASS TRANSITION; MICROHARDNESS; ORGANIC POLYMERS; PARTICLE REINFORCED COMPOSITES; SCANNING ELECTRON MICROSCOPY; SOLVENTS;

THERMAL EXPANSION;

EID: 79955830793 PISSN: 02540584 EISSN: None Source Type: Journal
DOI: 10.1016/j.matchemphys.2011.02.065 Document Type: Article

Times cited : (60)

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