Materials for electromagnetic interference shielding

Journal of Materials Engineering and Performance

Volumn 9, Issue 3, 2000, Pages 350-354

  Chung, D D L ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CEMENTS; ELASTOMERS; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTROMAGNETIC WAVE INTERFERENCE; GASKETS; GRAPHITE; MAGNETIC FIELDS; MAGNETIC PERMEABILITY; POROUS MATERIALS; RADIATION SHIELDING;

ELECTROMAGNETIC INTERFERENCE SHIELDING;

COMPOSITE MATERIALS;

EID: 0033716618     PISSN: 10599495     EISSN: None     Source Type: Journal    
DOI: 10.1361/105994900770346042     Document Type: Article

References (119)

1. D. Bjorklof: Compl. Eng., 1998, vol. 15 (5).
2. R. Brewer and G. Fenical: Eval. Eng., 1998, vol. 37 (7), pp. S-4-S-10.
3. P. O'Shea: Eval. Eng., 1998, vol. 37 (6), pp. 40, 43, 45, and 46.
4. R.S.R. Devender: Proc. Int. Conf. Electromagnetic Interference and Compatibility, IEEE, Piscataway, NJ, 1997, pp. 459-66.
5. B. Geddes: Control, 1996, vol. 9 (10).
6. S. Hempelmann: Galvanotechnik, 1997, vol. 88 (2), pp. 418-24.
7. W.D. Kimmel and D.D. Gerke: Med. Dev. Diagn. Industry, 1995, vol. 17 (7), pp. 112-15.
8. H.W. Markstein: Electr. Packaging Prod., 1995, vol. 35 (2).
9. K.A. McRae: National Conf. Publication - Institution of Engineers, Australian, IE Aust, Crows Nest, NSW, Australia, 1994, vol. 2 (94/11), pp. 495-98.
10. V.V. Sadchikov and Z.G. Prudnikova: Stalag Steel, 1997, Apr., No. 4, pp. 66-69.
11. S. Shinagawa, Y. Kumagai, and K. Urabe: J. Porous Mater., 1999, vol. 6 (3), pp. 185-90.
12. B.C. Jackson and G. Shawhan: IEEE Int. Symp. Electromagnetic Compatibility; IEEE, Piscataway, NJ, 1998, vol. 1, pp. 567-72.
13. R. Kumar, A. Kumar, and D. Kumar: Proc. Int. Conf. Electromagnetic Interference and Compatibility, IEEE, Piscataway, NJ, 1997, pp. 447-50.
14. L.G. Bhatgadde and S. Joseph: Proc. Int. Conf. Electromagnetic Interference and Compatibility, IEEE, Piscataway, NJ, 1997, pp. 443-45.
15. A. Sidhu, J. Reike, U. Michelsen, R. Messinger, E. Habiger, and J. Wolf: IEEE Int. Symp. Electromagnetic Compatibility, IEEE, Piscataway, NJ, 1997, pp. 102-05.
16. J. Hajdu: Trans. Inst. Met. Finishing, 1997, vol. 75, part 1, pp. B7-B10.
17. G. Klemmer: Special Areas Annual Technical Conf. - ANTEC, Conf. Proc., Society of Plastics Engineers, Brookfield, CT, 1996, vol. 3, pp. 3430-32.
18. D. Gwinner, P. Scheyrer, and W. Fernandez: Proc. Annual Technical Conf. - Society of Vacuum Coaters, Society of Vacuum Coaters, Albuquerque, NM, 1996, p. 336.
19. M.S. Bhatia: Proc. 1995 4th Int. Conf. Electromagnetic Interference and Compatibility, IEEE, Piscataway, NI, 1995, pp. 321-24.
20. L. Zhang, W. Li, J. Liu, and B. Ren: Cailiao Gongcheng/J. Mater. Eng., 1995, July, No. 7, pp. 38-41.
21. N.V. Mandich: Plating Surf. Finishing, 1994, vol. 81 (10), pp. 60-63.
22. B.C. Jackson and V. Kuzyk: IEEE Conf. Publication No. 396, IEEE, Stevenage, England, 1994, pp. 119-24.
23. C. Nagasawa, Y. Kumagai, K. Urabe, and S. Shinagawa: J. Porous Mater., 1999, vol. 6 (3), pp. 247-54.
24. D.S. Dixon and J. Masi: IEEE Int. Symp. Electromagnetic Compatibility, IEEE, Piscataway, NJ, 1998, pp. 1035-40.
25. P.J.D. Mason: Proc. Annual Technical Conf. - Society of Vacuum Coaters, Society of Vacuum Coaters, Albuquerque, NM, 1994, pp. 192-97.
26. C.A. Grimes: IEEE Aerospace Applications Conf. Proc., IEEE, Computer Society Press, Los Alamos, CA, 1994, pp. 211-21.
27. W.J. Biter, P.J. Jamnicky, and W. Coburn: Int. SAMPE Electronics Conf., SAMPE, Covina, CA, 1994, vol. 7, pp. 234-42.
28. L. Xing, J. Liu, and S. Ren: Cailiao Gongcheng/J. Mater. Eng., 1998. No. 1, pp. 19-21.
29. L. Rupprecht and C. Hawkinson: Med. Dev. Diagn. Industry, 1999. vol. 21 (1).
30. S. Tan, M. Zhang, and H. Zeng: Cailiao Gongcheng/J. Mater. Eng., 1998, No. 5, pp. 6-9.
31. R. Charbonneau: Proc. Int. SAMPE Symp. Exhib., SAMPE, Covina, CA, 1998, vol. 43 (1), pp. 833-44.
32. J.M. Kolyer: Proc. Int. SAMPE Symp. Exhib., SAMPE, Covina, CA, 1998, vol. 43(1), pp. 810-22.
33. S.L. Thompson: Eval. Eng., 1998, vol. 37 (7), pp. 62, 63, and 65.
34. D.A. Olivero and D.W. Radford: J. Reinforced Plastics Composites, 1998, vol. 17 (8), pp. 674-90.
35. K.P. Sau, T.K. Chaki, A. Chakraborty, and D. Khastgir: Plastics Rubber Composites Processing Applications, 1997, vol. 26 (7), pp. 291-97.
36. W.B. Genetti, B.P. Grady, and E.A. O'Rear: Materials Research Society Symp. Proc., MRS, Warrendale, PA, 1997, vol. 445, pp. 153-58.
37. J. Mao, J. Chen, M. Tu, W. Huang, and Y. Liu: Gongneng Cailiao/ J. Functional Mater., 1997, vol. 28 (2), pp. 137-39.
38. L. Rupprecht: Proc. Conf. Plastics for Portable and Wireless Electronics, Society of Plastics Engineers, Brookfield, CT, 1996, pp. 12-20.
39. B.K. Bachman: Proc. Conf. Plastics for Portable and Wireless Electronics, Society of Plastics Engineers, Brookfield, CT, 1996, pp. 7-11.
40. S. Schneider: Kunststoffe Plast. Eur., 1997, vol. 87 (4), pp. 487-88.
41. S. Schneider: Kunstetoffe Plast. Eur., 1997, vol. 87 (4), p. 26.
42. C.-Y. Huang and J.-F. Pai: J. Appl. Polymer Sci., 1997, vol. 63 (1), pp. 115-23.
43. M.W.K. Rosenow and J.A.E. Bell: Materials Annual Tech. Conf. - ANTEC, Conf. Proc., Society of Plastics Engineers, Brookfield, CT, 1997, vol. 2, pp. 1492-98.
44. M.W.K. Rosenow and J.A.E. Bell: Proc. Int. SAMPE Symp. Exhib., SAMPE, Covina, CA, 1998, vol. 43 (1), pp. 854-64.
45. M.A. Saltzberg, A.L. Neller, C.S. Harvey, T.E. Borninski, and R.J. Gordon: Circuit World, 1996, vol. 22 (3), pp. 67 and 68.
46. J. Wang, V.V. Varadan, and V.K. Varadan: SAMPE J., 1996, vol. 32 (6), pp. 18-22.
47. J.V. Masi and D.S. Dixon: Int. SAMPE Electronics Conf., SAMPE, Covina, CA, 1994, vol. 7, pp. 243-51.
48. H. Rahman, J. Dowling, and P.K. Saha: J. Mater. Proc. Technol., 1995, vol. 54 (1-4), pp. 21-28.
49. A.A. Dani and A.A. Ogale: Int. SAMPE Tech. Conf., SAMPE, Covina, CA, 1994, vol. 26, pp. 689-99.
50. D.W. Radford, J. Adv. Mater., 1994, vol. 26 (1), pp. 45-53.
51. C.M. Ma, A.T. Hu, and D.K. Chen: Polymers Polymer Composites, 1993, vol. 1 (2), pp. 93-99.
52. K. Miyashita and Y. Imai: Int. Progress Urethanes, 1993, vol. 6, pp. 195-218.
53. L. Li, P. Yih and D.D.L. Chung: J. Electronic Mater., 1992, vol. 21 (11), pp. 1065-71.
54. L. Li and D.D.L. Chung: Composites, 1994, vol. 25 (3), pp. 215-24.
55. L. Li and D.D.L. Chung: Polymer Composites, 1993, vol. 14 (5), pp. 361-66.
56. L. Li and D.D.L. Chung: Polymer Composites, 1993, vol. 14 (6), pp. 467-72.
57. L. Li and D.D.L. Chung: Composites, 1991, vol. 22 (3), pp. 211-18.
58. M. Zhu and D.D.L. Chung: J. Electronic Packaging, 1991, vol. 113, pp. 417-20.
59. M. Zhu and D.D.L. Chung: Composites, 1992, vol. 23 (5), pp. 355-64.
60. J.A. Pomposo, J. Rodriguez, and H. Grande: Synth. Met., 1999, vol. 104 (2), pp. 107-11.
61. J.-S. Park, S.-H. Ryn and O.-H. Chung: Annual Technical Conf. - ANTEC, Conf. Proc., Society of Plastics Engineers, Brookfield, CT, 1998, pp. 2410-14.
62. S. Courric and V.H. Tran: Polymer, 1998, vol. 39 (12), pp. 2399-2408.
63. M. Angelopoulos: Proc. Conf. Plastics for Portable and Wireless Electronics, Society of Plastics Engineers, Brookfield, CT, 1997, pp. 66.
64. T. Makela, S. Pienimaa, T. Taka, S. Jussila, and H. Isotalo: Synth. Met., 1997, vol. 85 (1-3), pp. 1335-36.
65. R. S. Kohlman, Y.G. Min, A.C. MacDiarmid, and A.J. Epstein: J. Eng. Appl. Sci., 1996, vol. 2, pp. 1412-16.
66. K. Naishadham: Int. SAMPE Electronics Conf., SAMPE, Covina, CA, 1994, vol. 7, pp. 252-65.
67. A. Kaynak, A. Polat, and U. Yilmazer: Mater. Res. Bull., 1996, vol. 31 (10), pp. 1195-1206.
68. A. Kaynak: Mater. Res. Bull., 1996, vol. 31 (7), pp. 845-60.
69. J. Joo, A.G. MacDiarmid, and A.J. Epstein: Ann. Tech. Conf. - ANTEC, Conf. Proc., Society of Plastic Engineers, Brookfield, CT, 1995, pp. 1672-77.
70. C.P.J.H. Borgmans and R.H. Glaser: Evaluation Eng., 1995, vol. 34 (7), pp. S-32-S-37.
71. P. Yan: Sci. Am., 1995, vol. 273 (1), pp. 82-87.
72. P.J. Mooney: JOM, 1994, vol. 46 (3), pp. 44-45.
73. H.H. Kuhn, A.D. Child, and W.C. Kimbrell: Synth. Mater., 1995, vol. 71 (1-3), part 3, pp. 2139-42.
74. M.T. Nguyen and A.F. Diaz: Adv. Mater., 1994, vol. 6 (11), pp. 858-60.
75. J. Unsworth, C. Conn, Z. Jin, A. Kaynak, R. Ediriweera, P. Innis, and N. Booth: J. Intelligent Mater. Systems Struct., 1994, vol. 5 (5), pp. 595-604.
76. A. Kaynak, J. Unsworth, R. Clout, A.S. Mohan, and G.E. Beard: J. Appl. Polymer Sci., 1994, vol. 54 (3), pp. 269-78.
77. A. Kaynak, A.S. Mohan, J. Unsworth, and R. Clout: J. Mater. Sci. Lett., 1994, vol. 13 (15), pp. 1121-23.
78. W. Sauerer: Galvanotechnik, 1994, vol. 85 (5), pp. 1467-72.
79. M.P. de Goefe and L.W. Steenbakkers: Kunststoffe Plast. Europe, 1994, vol. 84, pp. 16-18.
80. X. Fu and D.D.L. Chung: Carbon, 1998, vol. 36 (4), pp. 459-62.
81. L. Gnecco: Eval. Eng., 1999, vol. 38 (3).
82. S.-S. Lin: SAMPE J., 1994, vol. 30 (5), pp. 39-45.
83. Y. Kurosaki and R. Satake: IEEE Int. Symp. Electromagnetic Compatibility, IEEE, Piscataway. NJ, 1994, pp. 739-40.
84. X. Luo and D.D.L. Chung: Composites: Part B, 1999, vol. 30 (3), pp. 227-31.
85. M. Zhu, Y. Qiu, and J. Tian: Gongneng Cailiao/J. Functional Mater., 1998, vol. 29 (6), pp. 645-47.
86. D.A. Case and M.J. Oliver: Compliance Eng., 1999, vol. 16 (2), pp. 40, 42, 44, 46, 48, and 49.
87. S. Hudak: Eval. Eng., 1998, vol. 37 (8).
88. B.N. Prakash and L.D. Roy: Proc. Int. Conf. Electromagnetic Interference and Compatibility, IEEE, Piscataway, NJ, 1997, pp. 1 and 2.
89. S.H. Peng and K. Zhang: Annual Tech. Conf. - ANTEC, Conf. Proc., Society of Plastics Engineers. Brookfield, CT, 1998, vol. 2, pp. 1216-18.
90. S.K. Das, J. Nuebel, and B. Zand: IEEE Int. Symp. Electromagnetic Compatibility, IEEE, Piscataway, NJ, 1997, pp. 66-71.
91. S.H. Peng and W.S.V. Tzeng: IEEE Int. Symp. Electromagnetic Compatibility, IEEE, Piscataway, NJ, 1997, pp. 94-97.
92. P. O'Shea: Eval. Eng., 1997, vol. 36 (8).
93. P. O'Shea: Eval. Eng., 1996, vol. 35 (8).
94. Anonymous: Electronic Eng., 1996, vol. 68 (834).
95. B. Lee: Engineering, 1995, vol. 236 (10), pp. 32-33.
96. R.A. Rothenberg, D.C. Inman, and Y. Itani: IEEE Int. Symp. Electromagnetic Compatibility, IEEE, Piscataway, NJ, 1994, pp. 818.
97. B.D. Mottahed and S. Manoochehri: Polymer Eng. Sci., 1997, vol. 37 (3), pp. 653-66.
98. X. Shui and D.D.L. Chung: J. Electronic Packaging, 1997, vol. 119 (4), pp. 236-38.
99. X. Shui and D.D.L. Chung: J. Electronic Mater., 1997, vol. 26(8), pp. 928-34.
100. X. Shui and D.D.L. Chung: J. Electronic Mater., 1995, vol. 24 (2), pp. 107-13.
101. Y. Ramadin, S.A. Jawad, S.M. Musameh, M. Ahmad, A.M. Zihlif, A. Paesano, E. Martuscelli, and G. Ragosta: Polymer Int., 1994, vol. 34 (2), pp. 145-50.
102. M.-S. Lin: IEEE Int. Symp. Electronmagnetic Compatibility, IEEE, Piscataway, NJ, 1994, pp. 112-15.
103. H.-K. Chiu, M.-S. Lin, and C.H. Chen: IEEE Trans. Electromagnetic Compatibility, 1997, vol. 39 (4), pp. 332-39.
104. J.C. Roberts and P.D. Weinhold: J. Composite Mater., 1995, vol. 29 (14), pp. 1834-49.
105. D.A. Olivero and D.W. Radford: SAMPE J., 1997, vol. 33 (1), pp. 51-57.
106. M. Choate and G. Broadbent: Regional Tech. Conf. - Society of Plastic Engineers, Society of Plastic Engineers, Brookfield, CT, 1996, pp. 69-82.
107. P.D. Wienhold, D.S. Mehoke, J.C. Roberts, G.R. Seylar, and D.L. Kirkbride: Int. SAMPE Tech. Conf., SAMPE, Covina, CA, 1998, vol. 30, pp. 243-55.
108. A. Fernyhough and Y. Yokota: Mater. World, 1997, vol. 5 (4), pp. 202-04.
109. T. Hiramoto, T. Terauchi, and J. Tomibe: Electrical Overstress/ Electrostatic Discharge Symp. Proc., ESD Association, Rome, NY, 1998, pp. 18-21.
110. L.G. Morin Jr. and R.E. Duvall: Proc. Int. SAMPE Symp. Exhib., SAMPE, Covina, CA, 1998, vol. 43 (1) pp. 874-81.
111. J.R. Gaier and J. Terry: Int. SAMPE Electronics Conf., SAMPE, Covina, CA, 1994, vol. 7, pp. 221-33.
112. J.R. Gaier, M.L. Davidson, and R.K. Shively: Int. SAMPE Tech. Conf., SAMPE, Covina, CA, 1996, vol. 28, pp. 1136-47.
113. J.M. Liu, S.N. Vernon, A.D. Hellman, and T.A. Campbell: Proc. SPIE - The International Society of Optical Engineers, Society of Photo-Optical Instrumentation Engineers, Bellingham, WA, 1995, vol. 2459, pp. 60-68.
114. D.A. Olivero and D.W. Radford: Int. SAMPE Tech. Conf., SAMPE, Covina, CA, 1996, vol. 28, pp. 1110-21.
115. X. Luo and D.D.L. Chung: Carbon, 1996, vol. 34 (10), pp. 1293-94.
116. K. Shibata, T. Okabe, K. Saito, T. Okayama, M. Shimada, A. Yamamura, and R. Yamamoto: J. Porous Mater., 1997, vol. 4 (4), pp. 269-75.
117. T. Okabe, K. Saito, H. Togawa, and Y. Kumagai: Zairyo/J. Soc. Mater. Sci., Japan, 1995, vol. 44 (498), pp. 288-91.
118. B.M. Rakshit: Proc. 1995 4th Int. Conf. Electromagnetic Interference Compatibility, IEEE. Piscataway, NJ, 1995, pp. 413-415.
119. C.R. Paul: in Introduction to Electromagnetic Compatibility, K. Chang, ed., Wiley, New York, NY, 1992, pp. 649.