About the activation volume for cross-slip in Cu at high stresses

Acta Materialia

Volumn 59, Issue 10, 2011, Pages 4207-4215

  Couteau, Olivier ^a   Kruml, Tomas ^b   Martin, Jean Luc ^a  

^a EPFL   (Switzerland)

^b INSTITUTE OF PHYSICS OF MATERIALS   (Czech Republic)

Author keywords

Copper; Cross slip; Dislocation mobility; Stress relaxation technique; Thermally activated processes

Indexed keywords

ACTIVATION PARAMETER; ACTIVATION VOLUME; ATOMISTIC SIMULATIONS; CROSS-SLIP; DIRECT MEASUREMENT; DISLOCATION MOBILITY; FOREST DENSITY; HIGH STRESS; LINEAR ELASTICITY; PRE-DEFORMATION; SIMULATION RESULT; STRESS RELAXATION TECHNIQUE; THERMALLY ACTIVATED PROCESS;

COMPUTER SIMULATION; ELASTICITY; RESIDUAL STRESSES; SINGLE CRYSTALS; STRESS RELAXATION;

ACTIVATION ENERGY;

EID: 79955556940     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2011.03.045     Document Type: Article

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