Characterizing thermally activated dislocation mobility

Journal of Alloys and Compounds

Volumn 378, Issue 1-2, 2004, Pages 2-12

  Martin, J L ^a   Kruml, T ^a,b  

^a EPFL   (Switzerland)

^b INSTITUT JEAN LAMOUR   (France)

Author keywords

Activation parameters; Dislocation mobility; Mobile dislocation density; Thermal activation

Indexed keywords

CREEP; DEFORMATION; DISLOCATIONS (CRYSTALS); MECHANICAL TESTING; SHEAR STRESS; THERMOANALYSIS; THERMODYNAMICS; TRANSMISSION ELECTRON MICROSCOPY; VECTORS;

ACTIVATION PARAMETERS; DISLOCATION MOBILITY; MOBILE DISLOCATION DENSITY; THERMAL ACTIVATION;

CRYSTALS;

EID: 4344694412     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2003.10.063     Document Type: Conference Paper

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