Transient cooling of electronic components by flat heat pipes

Applied Thermal Engineering

Volumn 31, Issue 11-12, 2011, Pages 1877-1885

  Harmand, Souad ^a,b   Sonan, Raymond ^a,b   Faks, Michel ^c   Hassan, Hamdy ^a,b,d  

^a UNIV LILLE   (France)

^b LAMIH   (France)

^c VALEO   (France)

^d Assiut University   (Egypt)

Author keywords

Condensation; Electronics components; Evaporation; Heat pipe; Spreader; Transient cooling

Indexed keywords

CONDENSATION; EVAPORATION; HEAT PIPES; NETWORK COMPONENTS; SPREADERS; THERMAL CYCLING;

ELECTRONIC COMPONENT; ELECTRONICS COMPONENTS; EVAPORATION-CONDENSATION; MASS CONSERVATION EQUATIONS; THEORETICAL INVESTIGATIONS; TRANSIENT COOLING; TRANSIENT PRESSURES; TRANSIENT TEMPERATURE;

ELECTRONIC COOLING;

EID: 79955473052     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2011.02.034     Document Type: Article

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