Computational model for the transient analysis of flat heat pipes

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2000, Pages 106-113

  Sobhan, C B ^a   Garimella, S V ^a   Unnikrishnan, V V ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL METHODS; COOLING; FINITE DIFFERENCE METHOD; HEAT CONDUCTION; HEAT FLUX; HEAT TRANSFER COEFFICIENTS; MATHEMATICAL MODELS; PRESSURE; SPECIFIC HEAT OF SOLIDS; THERMAL CONDUCTIVITY; THERMAL EFFECTS;

ELECTRONICS COOLING; FLAT HEAT PIPES; HEAT PIPE WICK ANALYSIS; TRANSIENT ANALYSIS;

HEAT SINKS;

EID: 0033693930     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (25)