Wafer-level mechanical and electrical integration of SMA wires to silicon MEMS using electroplating

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2011, Pages 1281-1284

  Clausi, Donato ^a   Gradin, Henrik ^b   Braun, Stefan ^b   Peirs, Jan ^a   Reynaerts, Dominiek ^a   Stemme, Göran ^b   Van Der Wijngaart, Wouter ^b  

^a UNIVERSITY OF LEUVEN   (Belgium)

^b ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH; DESTRUCTIVE TESTING; ELECTRICAL CONNECTION; FOOT-PRINT DEVICES; INTEGRATION METHOD; LOW-POWER CONSUMPTION; MASS PRODUCTION; PROCESSING STEPS; SEM OBSERVATION; SHEAR TESTER; SILICON MEMS; SILICON SUBSTRATES; SMA WIRE; WAFER LEVEL;

ACTUATORS; BOND STRENGTH (MATERIALS); ELECTRIC CONNECTORS; MECHANICAL ENGINEERING; MECHANICS; REACTIVE ION ETCHING; SILICON WAFERS; WIRE;

MEMS;

EID: 79953789149     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2011.5734667     Document Type: Conference Paper

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