Tensile and thermal conductivity properties of epoxy nanocomposites thin film by spin coating technique

Key Engineering Materials

Volumn 471-472, Issue , 2011, Pages 1118-1123

  Voo, T V ^a   Mariatti, M ^a   Sim, L C ^b  

^a SCHOOL OF PHYSICS   (Malaysia)

^b Intel Technology Malaysia Sdn Bhd   (Malaysia)

Author keywords

Epoxy; Nanocomposites; Thermal conductivity; Thin film

Indexed keywords

FILLERS; FILM THICKNESS; III-V SEMICONDUCTORS; NANOCOMPOSITES; NITRIDES; SILICON NITRIDE; SYNTHETIC DIAMONDS; TENSILE STRENGTH; TENSILE TESTING; THERMAL CONDUCTIVITY; THERMAL CONDUCTIVITY OF SOLIDS; THIN FILMS;

CONDUCTIVITY PROPERTIES; EPOXY; EPOXY COMPOSITE; EPOXY NANOCOMPOSITES; FILLER LOADING; FRACTURE SURFACES; HIGH THERMAL CONDUCTIVITY; OTHER PROPERTIES;

NANOCOMPOSITE FILMS;

EID: 79952961563     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/KEM.471-472.1118     Document Type: Conference Paper

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