Grain size effect in the micro-V-bending process of thin metal sheets

Materials and Manufacturing Processes

Volumn 26, Issue 1, 2011, Pages 78-83

  Chen, Chang Cheng ^a   Jiang, Cho Pei ^b  

^a TECHNOLOGY AND SCIENCE INSTITUTE OF NORTHERN TAIWAN   (Taiwan)

^b NATIONAL FORMOSA UNIVERSITY   (Taiwan)

Author keywords

Bending; Microforming; Springback

Indexed keywords

AVERAGE GRAIN SIZE; BENDING; CONSTANT THICKNESS; GRAIN SIZE; GRAIN SIZE EFFECT; LASER DISPLACEMENT SENSORS; MATERIAL BEHAVIOR; MICROFORMING; SPRINGBACK; STANDARD DEVIATION; THICKNESS VARIATION; THIN METAL SHEETS; V-BENDING;

FORMING; GRAIN SIZE AND SHAPE; MICROFABRICATION; STEEL SHEET;

BENDING (DEFORMATION);

EID: 79952610715     PISSN: 10426914     EISSN: 15322475     Source Type: Journal    
DOI: 10.1080/10426911003636910     Document Type: Article

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