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MRS Bulletin

Volumn 36, Issue 2, 2011, Pages 97-100

Junction contact materials and interfaces in Si channel devices

(2) Loh, Wei Yip a Coss, Brian a

a SEMATECH (United States)

Author keywords

[No Author keywords available]

Indexed keywords

32 NM TECHNOLOGY; CHANNEL DEVICE; CONTACT MATERIAL; CONTACT RESISTIVITIES; INTERFACIAL DIPOLES; METAL WORK FUNCTION; NICKEL SILICIDE; SCHOTTKY BARRIERS;

PHASE MODULATION; SCHOTTKY BARRIER DIODES; SILICIDES;

SEMICONDUCTING SILICON COMPOUNDS;

EID: 79952510300 PISSN: 08837694 EISSN: None Source Type: Journal
DOI: 10.1557/mrs.2011.7 Document Type: Article

Times cited : (5)

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