On the chloride-induced pitting of ultra fine grains 5052 aluminum alloy produced by accumulative roll bonding process

Journal of Alloys and Compounds

Volumn 509, Issue 14, 2011, Pages 4696-4700

  Naeini, Mehdi Fadaei ^a   Shariat, Mohammad Hossain ^a   Eizadjou, Mehdi ^a  

^a SHIRAZ UNIVERSITY   (Iran)

Author keywords

AA 5052; Accumulative roll bonding; Pitting corrosion

Indexed keywords

3.5 WT% NACL SOLUTION; 5052 ALUMINUM ALLOY; AA 5052; ACCUMULATIVE ROLL-BONDING; IMMERSION TESTS; MICROSTRUCTURE REFINEMENT; PITTING CORROSION; PITTING CORROSION RESISTANCE; SEM-EDS; ULTRA FINE GRAIN;

ALUMINUM; ALUMINUM ALLOYS; CORROSION RESISTANCE; CYCLIC VOLTAMMETRY; DEFECT DENSITY; PITTING; SODIUM CHLORIDE;

ROLL BONDING;

EID: 79952451195     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2011.01.066     Document Type: Article

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