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Materials Science and Technology

Volumn 27, Issue 3, 2011, Pages 713-716

Effective thermal conductivity of Cu/diamond composites containing connected particles

(6) Chen, H a Chu, K a Jia, C C a Liang, X B a Guo, H b Qu, X H a

a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING (China)

b GENERAL RESEARCH INSTITUTE FOR NONFERROUS METALS (China)

Author keywords

Analytical modelling; Cu diamond composites; HPHT sintering; Thermal conductivity

Indexed keywords

ANALYTICAL MODEL; ANALYTICAL MODELLING; CU/DIAMOND COMPOSITES; EFFECTIVE MEDIUM; EFFECTIVE THERMAL CONDUCTIVITY; HIGH PRESSURE HIGH TEMPERATURE SINTERING; HPHT SINTERING; LARGE PARTICLES; PARTICLE LOADING; PARTICLE SIZE RANGES; SMALL PARTICLES; THERMAL CONDUCTIVITY ENHANCEMENT;

MATHEMATICAL MODELS; SINTERING;

THERMAL CONDUCTIVITY;

EID: 79952432533 PISSN: 02670836 EISSN: 17432847 Source Type: Journal
DOI: 10.1179/026708309X12567268926722 Document Type: Article

Times cited : (12)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.