Deep lateral anhydrous HF/methanol etching for MEMS release processes

Journal of Micro/Nanolithography, MEMS, and MOEMS

Volumn 7, Issue 3, 2008, Pages

  Erdamar, Meltem ^a,d   Shanmugasundaram, Karthikeyan ^a   Roman, Paul ^b   Mumbauer, Paul ^b   Klimkiewicz, Maria ^c   Ruzyllo, Jerzy ^a  

^a The Pennsylvania State University   (United States)

^b Primaxx Inc   (United States)

^c PENNSYLVANIA STATE UNIVERSITY   (United States)

^d INTEL CORPORATION   (United States)

Author keywords

Anhydrous HF etching; Anhydrous HF methanol MEMS release; Lateral etching; MEMS release; Stiction free MEMS release

Indexed keywords

COMPOSITE MICROMECHANICS; HYDROFLUORIC ACID; MEMS; METHANOL; MICROELECTROMECHANICAL DEVICES; SILICON COMPOUNDS; SILICON OXIDES; SILICON WAFERS; STICTION;

ANHYDROUS HF METHANOL MEMS RELEASE; CONFINED GEOMETRIES; ETCH CHEMISTRY; ETCH RATES; ETCHING TECHNIQUE; GASPHASE; HF ETCHING; LATERAL ETCHING; PROCESS THROUGHPUT; RELEASE PROCESS; REPRODUCIBILITIES; SACRIFICIAL OXIDE; SILICON CANTILEVER; SILICON-ON-INSULATOR SUBSTRATES; STICTION-FREE MEMS RELEASE; VAPOR MIXTURE; WAFER TEMPERATURE;

ETCHING;

EID: 79952041948     PISSN: 19325150     EISSN: 19325134     Source Type: Journal    
DOI: 10.1117/1.2959177     Document Type: Article

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