Heterogeneous chip integration process for flexible wireless microsystem application

IEEE Transactions on Electron Devices

Volumn 58, Issue 3, 2011, Pages 906-909

  Chao, Tzu Yuan ^a   Liang, Chia Wei ^a   Cheng, Y T ^a   Kuo, Chien Nan ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

AuAu thermocompressive (TC) bonding; bumpless interconnecting; flexible electronics; flip chip; heterogeneous chip integration; surface cleaning

Indexed keywords

AUAU THERMOCOMPRESSIVE (TC) BONDING; BONDING STRENGTH; BUMPLESS INTERCONNECTING; CHIP INTEGRATION; COMPLEMENTARY METAL OXIDE SEMICONDUCTORS; FLIP CHIP; HETEROGENEOUS CHIP INTEGRATION; HETEROGENEOUS INTEGRATION; LOW TEMPERATURES; MICROSTRIPES; ORGANIC SUBSTRATE; RADIO FREQUENCY SYSTEMS; RETURN LOSS; RF PERFORMANCE; WIRELESS MICROSYSTEM;

CLEANING; FLIP CHIP DEVICES; METAL CLEANING; MICROSYSTEMS; SILICONES;

FLEXIBLE ELECTRONICS;

EID: 79952038690     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/TED.2010.2102357     Document Type: Article

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