Engineered substrates for future more moore and more than moore integrated devices

Technical Digest - International Electron Devices Meeting, IEDM

Volumn , Issue , 2010, Pages

  Clavelier, L ^a   Deguet, C ^a   Di Cioccio, L ^a   Augendre, E ^a   Brugere, A ^a   Gueguen, P ^a   Le Tiec, Y ^a   Moriceau, H ^a   Rabarot, M ^a   Signamarcheix, T ^a   Widiez, J ^a   Faynot, O ^a   Andrieu, F ^a   Weber, O ^a   Le Royer, C ^a   Batude, P ^a   Hutin, L ^a   Damlencourt, J F ^a   Deleonibus, S ^a   Defay E ^a  

^a CEA LETI   (France)

Author keywords

[No Author keywords available]

Indexed keywords

DEVICE PERFORMANCE; DIRECT BONDING; ENGINEERED-SUBSTRATE; HIGH QUALITY; HIGH QUALITY SINGLE CRYSTALS; INTEGRATED DEVICE; MASS PRODUCTION; MATURE PRODUCT; NEW MATERIAL; SILICON-ON-INSULATOR SUBSTRATES; SINGLE CRYSTAL WAFERS; SMART-CUT; SOI SUBSTRATES;

ELECTRON DEVICES; PATENTS AND INVENTIONS; SILICON WAFERS; SINGLE CRYSTALS; SUBSTRATES; WAFER BONDING;

SILICON ON INSULATOR TECHNOLOGY;

EID: 79951832478     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEDM.2010.5703285     Document Type: Conference Paper

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