The cryogenic thermal expansion and mechanical properties of plasma modified ZrW2O8 reinforced epoxy

Materials Science and Engineering: A

Volumn 528, Issue 9, 2011, Pages 3367-3374

  Chu, Xinxin ^a,b   Huang, Rongjin ^a   Yang, Huihui ^a,b   Wu, Zhixiong ^a,b   Lu, Junfeng ^a   Zhou, Yuan ^a   Li, Laifeng ^a  

^a TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

Author keywords

Epoxy composites; Plasma coating; Thermal expansion properties

Indexed keywords

CHEMICAL MODIFICATION; CRYOGENICS; DISPERSIONS; EPOXY RESINS; FILLERS; PLASMA CVD; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; REINFORCEMENT; SURFACE TREATMENT; THERMAL EXPANSION; ZIRCONIUM COMPOUNDS;

CHEMICAL VAPOR DEPOSITION PROCESS; CRYOGENIC TEMPERATURES; EPOXY COMPOSITE; EPOXY MATRICES; NEGATIVE THERMAL EXPANSION MATERIAL; PLASMA COATING; REINFORCED EPOXY; SURFACE-MODIFICATION; THERMAL EXPANSION PROPERTIES; THERMAL MECHANICAL PROPERTIES;

EPOXY COMPOSITES;

EID: 79951680924     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2011.01.003     Document Type: Article

References (34)

1. Fabian P.E., Schutz J.B., Hazelton C.S., Reed R.P. Adv. Cryog. Eng. Mater. 1994, 40:1007-1014.
2. Yang G., Fu S.Y., Yang J.P. Polymer 2007, 48:302-310.
3. Shindo Y., Takano S., Horiguchi K., Sato T. Cryogenics 2006, 46:794-798.
4. Shindo Y., Takano S., Narita F., Horiguchi K. Fusion Eng. Des. 2006, 81:2479-2483.
5. Meijerink J.I., Eguchi S., Ogata M., Ishii T., Amagi S., Numata S., Sashima H. Polymer 1994, 35:179-186.
6. McGrath L.M., Parnas R.S., King S.H., Schroeder J.L., Fischer D.A., Lenhart J.L. Polymer 2008, 49:999-1014.
7. Huang C.J., Fu S.Y., Zhang Y.H., Lauke B., Li L.F., Ye L. Cryogenics 2005, 45:450-454.
8. Jan I.N., Lee T.M., Chiou K.C., Lin J.J. Ind. Eng. Chem. Res. 2005, 44:2086-2090.
9. Karak N. J. Polym. Mater. 2006, 23:1-20.
10. Lan T., Pinnavaia T.J. Chem. Mater. 1994, 6:2216-2219.
11. Fahmy A.A., Ragai A.N. J. Appl. Phys. 1970, 41:5112-5115.
12. Yasmin A., Daniel I.M. Polymer 2004, 45:8211-8219.
13. Perottoni C.A., da Jornada J.A.H. Science 1998, 280:886-889.
14. Mary T.A., Evans J.S.O., Vogt T., Sleight A.W. Science 1996, 272:90-92.
15. Evans J.S.O., Mary T.A., Vogt T., Subramanian M.A., Sleight A.W. Chem. Mater. 1996, 8:2809-2823.
16. Mancheva M.N., Iordanova R.S., Dimitriev Y.B., Petrov K.P., Avdeev G.V. J. Phys. Chem., C 2007, 111:14945-14947.
17. Wilkinson A.P., Lind C., Pattanaik S. Chem. Mater. 1999, 11:101-108.
18. Shi J.D., Pu Z.J., Wu K.H., Larkins G. Mater. Res. Soc. Symp. Proc. 1997, 445:229-234.
19. Sullivan L.M., Lukehart C.M. Chem. Mater. 2005, 17:2136-2141.
20. Tani J., Kimura H., Hirota K., Kido H. J. Appl. Polym. Sci. 2007, 106:3343-3347.
21. Haman K., Badrinarayanan P., Kessler M.R. Appl. Mater. Interfaces 2009, 1:1190-1195.
22. Goertzen W.K., Kessler M.R. J. Therm. Anal. Calorim. 2008, 93:87-93.
23. Shi D.L., Wang S.X., Ooij W.J.v., Wang L.M., Zhao J.G., Yu Z. Appl. Phys. Lett. 2001, 73:1243-1245.
24. Shi D.L., Lian J., He P., Wang L.M., Ooij W.J.v., Schulz M.J., Liu Y.J., Mast D.B. Appl. Phys. Lett. 2002, 81:5216-5218.
25. Cho H., Shi D.L., Guo Y., Lian J., Ren Z.F., Poudel B., Song Y., Abot J.L., Singh D., Routbort J., Wang L.M., Ewing R.C. J. Appl. Phys. 2008, 104:074302.
26. Orrhede M., Tolani R., Salama K. Res. Nondestruct. Eval. 1996, 8:23-37.
27. Vo H.T., Todd M., Shi F.G., Shapiro A.A., Edwards M. Microelectron. J. 2001, 32:331-338.
28. Chu X.X., Wu Z.X., Huang R.J., Zhou Y., Li L.F. Cryogenics 2010, 50:84-88.
29. Schapery R.A. J. Compos. Mater. 1968, 2:380-404.
30. Hashin Z. J. Appl. Mech.: Trans. ASME 1983, 50:481-505.
31. Hashin Z., Shtrikman S. J. Mech. Phys. Solids 1963, 11:127-140.
32. Drymiotis F.R., Ledbetter H., Betts J.B., Kimura T., Lashley J.C., Migliori A., Ramirez A.P., Kowach G.R., Van Duijn J. Phys. Rev. Lett. 2004, 93:059903.
33. Chen C.G., Justice R.S., Schaefer D.W., Baur J.W. Polymer 2008, 49:3805-3815.
34. Kathi J., Rhee K.Y., Lee J.H. Composites Part A 2009, 40:800-809.