Cell adhesive and growth behavior on electrospun nanofibrous scaffolds by designed multifunctional composites

Colloids and Surfaces B: Biointerfaces

Volumn 84, Issue 1, 2011, Pages 26-34

  Cao, Ding ^a   Wu, Yi Pan ^b   Fu, Zhi Feng ^a   Tian, Yuan ^c   Li, Cong Ju ^c   Gao, Chun Ying ^b   Chen, Zhong Liang ^b   Feng, Xi Zeng ^b  

^a BEIJING UNIVERSITY OF CHEMICAL TECHNOLOGY   (China)

^b NANKAI UNIVERSITY   (China)

^c BEIJING INSTITUTE OF FASHION TECHNOLOGY   (China)

Author keywords

Electrospinnning; Nanofibrous scaffolds; Tissue engineering

Indexed keywords

BIOCOMPOSITE SCAFFOLDS; CELL ATTACHMENTS; CELL-ADHESIVES; COMPOSITE SCAFFOLDS; ELECTROSPINNNING; ELECTROSPUNS; EXTRACELLULAR MATRICES; FLUORESCEIN DIACETATE; FOURIER TRANSFORM INFRARED; GROWTH BEHAVIOR; MULTIFUNCTIONAL COMPOSITES; NANO-STRUCTURED; NANOFIBROUS SCAFFOLDS; NANOSCALE STRUCTURE; PLLA; POLY-L-LACTIDE; PORE NETWORKS; PROPIDIUM IODIDE; SEM; STAINING METHOD; T CELLS; TISSUE ENGINEERING APPLICATIONS; VIABLE CELLS; WATER CONTACT ANGLE;

BIOCOMPATIBILITY; COLLAGEN; CONTACT ANGLE; FOURIER TRANSFORMS; HYDROXYAPATITE; NANOFIBERS; SCANNING ELECTRON MICROSCOPY; TENSILE TESTING; TISSUE; TISSUE ENGINEERING; X RAY PHOTOELECTRON SPECTROSCOPY;

SCAFFOLDS;

4',6 DIAMIDINO 2 PHENYLINDOLE; COLLAGEN; FLUORESCEIN DIACETATE; HYDROXYAPATITE; MOLECULAR SCAFFOLD; POLYLACTIDE; PROPIDIUM IODIDE;

ARTICLE; BIOCOMPATIBILITY; CELL ADHESION; CELL ASSAY; CELL CONTACT; CELL DENSITY; CELL GROWTH; CELL PROLIFERATION; CELL VIABILITY; COMPOSITE MATERIAL; CONTACT ANGLE; CONTROLLED STUDY; ELECTROSPINNING; EMBRYO; EXTRACELLULAR MATRIX; HUMAN; HUMAN CELL; HYDROPHILICITY; INFRARED SPECTROSCOPY; MOLECULAR STABILITY; NANOANALYSIS; NANOFABRICATION; POROSITY; PRIORITY JOURNAL; PROCESS DESIGN; SCANNING ELECTRON MICROSCOPY; STRUCTURE ANALYSIS; TENSILE STRENGTH; TISSUE ENGINEERING; WETTABILITY; X RAY PHOTOELECTRON SPECTROSCOPY;

CELL ADHESION; COLLAGEN; DURAPATITE; MICROSCOPY, ELECTRON, SCANNING; NANOSTRUCTURES; POLYESTERS; SPECTROSCOPY, FOURIER TRANSFORM INFRARED; SURFACE PROPERTIES; TISSUE ENGINEERING;

EID: 79951675300     PISSN: 09277765     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.colsurfb.2010.12.005     Document Type: Article

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