Alumina-copper eutectic bond strength: Contribution of preoxidation, cuprous oxides particles and pores

Scientia Iranica

Volumn 16, Issue 3 B, 2009, Pages 263-268

  Ghasemi, H ^a   Faghihi Sani, M A ^a   Kokabi, A H ^a   Riazi, Z ^b  

^a SHARIF UNIVERSITY OF TECHNOLOGY   (Iran)

^b ATOMIC ENERGY ORGANIZATION OF IRAN   (Iran)

Author keywords

Alumina copper; Bonding; Peel strength

Indexed keywords

ALUMINA; ALUMINUM OXIDE; BONDING; COPPER; EUTECTICS; FURNACES; HYDROGEN; PHASE INTERFACES; SOLAR CONTROL FILMS; VACUUM FURNACES;

BONDING PROCEDURE; BONDING PROCESS; FURNACE ATMOSPHERE; JOINT INTERFACES; JOINT STRENGTH; OXYGEN PARTIAL PRESSURE; PEEL STRENGTH; PORE FORMATION;

COPPER OXIDES;

ALUMINUM OXIDE; CHEMICAL BONDING; COOLING; COPPER COMPOUND; HYDROGEN; MECHANICAL PROPERTY; MICROSTRUCTURE; OXIDATION; OXIDE; PARTIAL PRESSURE; POROSITY; STRENGTH;

ATRA;

EID: 79951612274     PISSN: 10263098     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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