The influence of CuAlO2 on the strength of eutectically bonded Cu/Al2O3 interfaces

Scripta Materialia

Volumn 46, Issue 5, 2002, Pages 395-400

  Seager, C W ^a   Kokini, K ^a   Trumble, K ^a   Krane, M J M ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

Alumina; Bonding; Copper; Joining

Indexed keywords

BOND STRENGTH (MATERIALS); BRITTLE FRACTURE; COPPER ALLOYS; CRACK PROPAGATION; EUTECTICS; FRACTURE TOUGHNESS;

FRACTURE RESISTANCE;

INTERFACES (MATERIALS);

EID: 0036499825     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(02)00012-X     Document Type: Article

References (9)