On the influence of small quantities of Bi and Sb on the evolution of microstructure during swaging and heat treatments in copper

Journal of Alloys and Compounds

Volumn 509, Issue 10, 2011, Pages 4073-4080

  Otto, F ^a   Frenzel, J ^a   Eggeler, G ^a  

^a RUHR UNIVERSITY BOCHUM   (Germany)

Author keywords

Antimony; Bismuth; Copper; Microstructure; Rotary swaging; Thermomechanical processing

Indexed keywords

ANNEALING TREATMENTS; HARDENING BEHAVIOR; HIGHER TEMPERATURES; INGOT METALLURGY; INTERMEDIATE ANNEALINGS; LOW TEMPERATURES; ORIENTATION IMAGING MICROSCOPY; OUTER DIAMETERS; PROCESSING ROUTE; RECRYSTALLIZATIONS; ROTARY SWAGING; THERMO-MECHANICAL PROCESSING; VACUUM INDUCTION;

ALLOYING ELEMENTS; BISMUTH; COPPER; GRAIN BOUNDARIES; HARDNESS TESTING; INGOTS; MICROSTRUCTURAL EVOLUTION; OPTICAL MICROSCOPY; PLASTIC FLOW; RECRYSTALLIZATION (METALLURGY); TEXTURES;

SWAGING;

EID: 79851516459     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2010.12.178     Document Type: Article

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