High-speed plating for electronic applications

Electrochimica Acta

Volumn 47, Issue 1, 2001, Pages 109-116

  De Vogelaere, Marc ^a   Sommer, Volkmar ^a   Springborn, Heike ^a   Michelsen Mohammadein, Ursula ^a  

^a SIEMENS AG   (Germany)

Author keywords

Contact material; Electroforming; Inter linked production line; Jet plating; Microstructure; Printed circuit boards; Product specific plating tools; Selective coating

Indexed keywords

COST EFFECTIVENESS; ELECTROFORMING; INVESTMENTS; MICROSTRUCTURE; PRINTED CIRCUIT MANUFACTURE; PRODUCTION ENGINEERING; STRATEGIC PLANNING;

INTER-LINKED PRODUCTION LINES; JET PLATING; SELECTIVE COATING;

ELECTROPLATING;

EID: 0035450662     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0013-4686(01)00555-2     Document Type: Article

References (2)

1. Weber, Mollath, Müller, De Vogelaere, Michelsen-Mohammadein, Verbundvorhaben Fertigungsintegrierte Oberflächenbehandlung (FIO), Galvanotechnik 11 (2000) 3071.
2. Sommer, Galvanoformung für Spritzgußwerkzeuge-Galvanisches Abformen von MikroStrukturen für die optische Kommunikation-stechnik, Galvanotechnik 3 (2000) 791.