Strength and strain hardening behavior of Cu-based bilayers and trilayers

Scripta Materialia

Volumn 64, Issue 7, 2011, Pages 641-644

  Bellou, A ^a   Overman, C T ^a   Zbib, H M ^a   Bahr, D F ^a   Misra, A ^b  

^a Washington State University   (United States)

^b LOS ALAMOS NATIONAL LABORATORY   (United States)

Author keywords

Hardness; Multilayers; Nanocomposite; Nanoindentation; Strain hardening

Indexed keywords

BI-LAYER; BI-LAYER FILMS; CROSS-SLIP; CU-BASED; DIRECT MEASUREMENT; DISLOCATION DYNAMICS SIMULATION; EFFECTIVE STRAIN; FLOW STRENGTH; METALLIC MULTILAYERS; NANOINDENTATION IMPRESSIONS; OUT-OF-PLANE; STRAIN HARDENING BEHAVIOR; TRILAYER FILM; TRILAYERS;

COPPER; GEOMETRY; HARDNESS; NANOCOMPOSITES; NANOINDENTATION; PLASTICITY; STRAIN; STRAIN HARDENING; THREE DIMENSIONAL;

MULTILAYERS;

EID: 79251597679     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2010.12.009     Document Type: Article

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