High-spatial-resolution sub-surface imaging using a laser-based acoustic microscopy technique

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control

Volumn 58, Issue 1, 2011, Pages 226-233

  Balogun, Oluwaseyi ^a   Cole, Garrett D ^b   Huber, Robert ^b   Chinn, Diane ^b   Murray, Todd W ^c   Spicer, James B ^d  

^a Northwestern University   (United States)

^b LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

^c University of Colorado   (United States)

^d Whiting School of Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC MICROSCOPY; BROADBAND ACOUSTIC WAVES; COUPLING MEDIUM; DETECTION APPROACH; ELASTIC CHARACTERIZATION; ENERGY LOSS; GEOMETRICAL FEATURES; GIGAHERTZ RANGE; HIGH SPATIAL RESOLUTION; MICROMETER-SCALE; OPTICAL GENERATION; OPTICAL INTERFEROMETER; PENETRATION DEPTH; PULSED LASER; PULSED LASER SOURCES; SCANNING ACOUSTIC MICROSCOPY; SINGLE-CRYSTAL SILICON WAFERS; SOLID MEDIA; SPATIAL RESOLUTION; SUB-SURFACE IMAGING;

ACOUSTIC MICROSCOPES; ACOUSTIC VARIABLES MEASUREMENT; ACOUSTIC WAVE PROPAGATION; ACOUSTIC WAVES; CRYSTAL ORIENTATION; ENERGY DISSIPATION; MICROMETERS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; ULTRASONIC APPLICATIONS; ULTRASONICS; UNDERWATER ACOUSTICS;

PULSED LASERS;

ACOUSTIC MICROSCOPY; EQUIPMENT DESIGN; INSTRUMENTATION; LASER; LETTER; METHODOLOGY; SIGNAL PROCESSING; SURFACE PROPERTY;

EQUIPMENT DESIGN; LASERS; MICROSCOPY, ACOUSTIC; SIGNAL PROCESSING, COMPUTER-ASSISTED; SURFACE PROPERTIES;

EID: 78751678040     PISSN: 08853010     EISSN: None     Source Type: Journal    
DOI: 10.1109/TUFFC.2011.1789     Document Type: Article

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