Analysis of the three-dimensional delamination behavior of stretchable electronics applications

Key Engineering Materials

Volumn 417-418, Issue , 2010, Pages 9-12

  Van Der Sluis, O ^a,c   Timmermans, P H M ^a   Van Der Zanden, E J L ^b   Hoefnagels, J P M ^b  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

^c DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

Cohesive zone modeling; Delamination; Fracture mechanics; Peel test; Stretchable electronics; Thin films

Indexed keywords

DELAMINATION; FRACTURE MECHANICS; MICROSTRIP LINES; PEELING; RUBBER; THIN FILMS;

APPLICATION AREA; COHESIVE FAILURES; COHESIVE ZONE MODEL; HIGH COMPLIANCES; INTERFACE PROPERTY; METAL CONDUCTOR LINE; PEEL TESTS; STRETCHABLE ELECTRONICS;

FLEXIBLE ELECTRONICS;

EID: 70350333824     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/KEM.417-418.9     Document Type: Conference Paper

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