Stretching-induced interconnect delamination in stretchable electronic circuits

Journal of Physics D: Applied Physics

Volumn 44, Issue 3, 2011, Pages

  Van Der Sluis, O ^a,b   Hsu, Y Y ^c,d   Timmermans, P H M ^a   Gonzalez, M ^c   Hoefnagels, J P M ^b  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

^c IMEC   (Belgium)

^d UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

COMPLIANT SUBSTRATES; DESIGN FREEDOM; ELECTRONIC PRODUCT; FINITE ELEMENT SIMULATIONS; GLOBAL FORCES; IN-SITU ANALYSIS; INTERCONNECT DESIGN; INTERCONNECT STRUCTURES; INTERFACE BEHAVIOUR; INTERFACE PROPERTY; LARGE DEFORMATIONS; NUMERICAL SIMULATION; PEEL TESTING; RUBBER MATERIAL; STRETCHABLE ELECTRONICS; THIN METALS;

DELAMINATION; FAILURE ANALYSIS; MICROSTRIP LINES; RUBBER; STEEL SHEET;

RUBBER TESTING;

EID: 78650634811     PISSN: 00223727     EISSN: 13616463     Source Type: Journal    
DOI: 10.1088/0022-3727/44/3/034008     Document Type: Article

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