Crystallization and annealing effects of sputtered tin alloy films on electromagnetic interference shielding

Applied Surface Science

Volumn 257, Issue 8, 2011, Pages 3733-3738

  Hung, Fei Shuo ^a   Hung, Fei Yi ^a   Chiang, Che Ming ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Electromagnetic interference (EMI); Sn Al; Sn Cu

Indexed keywords

ALUMINUM ALLOYS; ANNEALING; BINARY ALLOYS; COPPER; ELECTROMAGNETIC PULSE; ELECTROMAGNETIC SHIELDING; ELECTROMAGNETIC WAVE INTERFERENCE; SHIELDING; SIGNAL INTERFERENCE; THIN FILMS;

ANNEALING EFFECTS; ATOMIC CONCENTRATION; CRYSTALLIZATION MECHANISMS; CRYSTALLIZATION TREATMENT; ELECTRICAL CONDUCTIVITY; ELECTROMAGNETIC INTERFERENCE SHIELDING; HIGHER FREQUENCIES; SHIELD EFFICIENCY;

TIN ALLOYS;

EID: 78651372693     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2010.11.126     Document Type: Article

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