Micro-contact CSP

Advanced Packaging

Volumn 16, Issue 1, 2007, Pages 38-41

  Moran, Sean ^a   Solberg, Vern ^a   Wade, Christopher P ^a  

^a Tessera Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER BUMP; LEAD-FREE PACKAGING; MICROCONTACTS; PACKAGE-ON-PACKAGE (POP) STACKING;

LEAD; SOLDERED JOINTS; SURFACE MOUNT TECHNOLOGY;

CHIP SCALE PACKAGES;

ELECTRONICS; LEAD; SOLDERING;

EID: 34047249610     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (0)