Transfer layer technology for the packaging of high power modules

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

Volumn , Issue , 2010, Pages

  Balucani, Marco ^a   Nenzi, Paolo ^a   Crescenzi, Rocco ^a   Dolgyi, Leonid ^b   Klyshko, Alexey ^b   Bondarenko, Vitaly ^b  

^a SAPIENZA UNIVERSITY OF ROME   (Italy)

^b BELARUSIAN STATE UNIVERSITY OF INFORMATICS AND RADIOELECTRONICS   (Belarus)

Author keywords

[No Author keywords available]

Indexed keywords

FUNDAMENTAL LIMITATIONS; HIGH COSTS; HIGH FREQUENCY CIRCUITS; HIGH POWER MODULE; INTEGRATED POWER MODULE; LOW EMI; MONOLITHIC INTEGRATION; NEW TECHNOLOGIES; POWER DEVICES; POWER ELECTRONIC DEVICES; POWER ELECTRONIC MODULES; POWER IC; PRODUCTION PHASE; PROTECTION CIRCUITS; THREE DIMENSIONAL PACKAGING; TRANSFER LAYERS; WIRE BONDING;

ELECTRIC EQUIPMENT; ELECTRIC POWER SYSTEMS; ELECTRON DEVICES; ELECTRONICS PACKAGING; MICROPROCESSOR CHIPS; MONOLITHIC INTEGRATED CIRCUITS; POLYCHLORINATED BIPHENYLS; PRINTED CIRCUITS; SENSORS; WIRE;

TECHNOLOGY;

EID: 78651314812     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2010.5642974     Document Type: Conference Paper

References (10)

1. Lostetter A.B., Barlow F., Elshabini A., "An overview to integrated power module design for high power electronics packaging," Microelectronics Reliability, Vol. 40, No. 3 (2000), pp. 365-379.
2. Amro R.A., " Packaging and Interconnection Technologies of Power Devices, Challenges and Future Trends", World Academy of Science, Engineering and Technology, 49 (2009), pp. 691-694.
3. Stockmeier T., "From Packaging to Un-Pacakging - Trends in Power Semiconductor Modules", Proc. 20th Int. Symp. Power Semicond. Devices IC.
4. Balucani M., (WO/2007/104799) Interconnection of Electronic Devices with Raised Leads, 2007.
5. Balucani M., (US20080012114) System for contacting electronic devices and production processes thereof, 2007.
6. Sakaguchi K. Et al, "Current Progress in Epitaxial Layer Transfer (EL TRAN®)", IEICE Transactions on Electronics, Vol. E80-C, No.3, pp.378-387
7. Holm R., Electric Contacts, Springer-Verlag, (1967).
8. Dowling N.E., Mechanical Behavior of Materials, Prentice Hall (Upper Saddle River, NJ, (1998), pp. 166-204.
9. Stephens L. S., Liu Y., Meletis E. I., "Finite Element Analysis of the Initial Yielding Behavior of a Hard Coating/Substrate System With Functionally Graded Interface Under Indentation and Friction", Journal of Tribology Transactions of A SME Vol. 122, April 2000 pp 381-387.
10. Stavroulaki M.E., Stavroulakis G.E., "Unilateral Contact Application Using FEM Software", Int. J. Appl. Math. Comput. Sci., Vol.12, No.1 (2002), pp.115-125.