A novel polymeric coating with high thermal Conductivity

Polymer - Plastics Technology and Engineering

Volumn 48, Issue 12, 2009, Pages 1230-1238

  Zhou, Wenying ^a,b   Yu, Demei ^b   An, Qunli ^c  

^a XI'AN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b XI'AN JIAOTONG UNIVERSITY   (China)

^c NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

Author keywords

Dielectric constant; High temperature resistance; Mechanical property; Modified epoxy; Thermal conductivity

Indexed keywords

ALN; DIELECTRIC STRENGTHS; DIELECTRIC STUDIES; FILLER CONCENTRATION; FILLER CONTENTS; HIGH TEMPERATURE RESISTANCE; HIGH THERMAL CONDUCTIVITY; HYDROXYL-TERMINATED; MASS RATIO; MODIFIED EPOXY; POLYMERIC COATINGS; SYNERGISTIC EFFECT; VOLUME RESISTIVITY;

ALUMINUM NITRIDE; COATINGS; EPOXY RESINS; FILLERS; MECHANICAL PROPERTIES; PERMITTIVITY; SILICONES; TEMPERATURE CONTROL; THERMOGRAVIMETRIC ANALYSIS;

THERMAL CONDUCTIVITY;

EID: 78651306653     PISSN: 03602559     EISSN: 15256111     Source Type: Journal    
DOI: 10.1080/03602550903159051     Document Type: Article

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