Synthesis and properties of vinyl siloxane modified cresol novolac epoxy for electronic encapsulation

Journal of Applied Polymer Science

Volumn 79, Issue 4, 2001, Pages 652-661

  Tai, Horng Jer ^a   Wang, J B ^a   Chen, Jiunn Hsiung ^a   Chou, Hui Lung ^a  

^a I SHOU UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MODIFICATION; CROSSLINKING; ELASTIC MODULI; ELECTRONICS PACKAGING; ENCAPSULATION; GLASS TRANSITION; MOISTURE; REACTION KINETICS; SYNTHESIS (CHEMICAL); THERMAL DIFFUSION IN SOLIDS; THERMAL STRESS; VINYL RESINS;

CROSSLINKING DENSITY; VINYL SILOXANE (VS);

EPOXY RESINS;

EID: 0035154407     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/1097-4628(20010124)79:4<652::AID-APP90>3.0.CO;2-U     Document Type: Article

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