Curing characteristics of o-cresol novolac epoxy resin modified by bismaleimide

Journal of Polymer Science, Part A: Polymer Chemistry

Volumn 34, Issue 6, 1996, Pages 957-962

  Kim, Whan Gun ^a   Nam, Tae Young ^b  

^a Seokyeong University   (South Korea)

^b Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

Bismaleimide; Curing; Epoxy resin; FTIR; Glass transition temperature

Indexed keywords

CHEMICAL MODIFICATION; CURING; FOURIER TRANSFORM INFRARED SPECTROSCOPY; GLASS TRANSITION; PHENOLIC RESINS; TEMPERATURE MEASUREMENT;

BISMALEIMIDE; CRESOL NOVOLAC EPOXY RESIN; DIAMINODIPHENYLMETHANE; HARDENER; WEIGHT RATIO;

EPOXY RESINS;

EID: 0030127121     PISSN: 0887624X     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1099-0518(19960430)34:6<957::AID-POLA4>3.0.CO;2-F     Document Type: Article

References (15)

1. N. Kinjo, M. Ogata, K. Nishi, and A. Kaneda, Adv. Polym. Sci., 88, 1 (1989).
2. W. G. Kim, INFOSAIT, 3, 24 (1990).
3. W. G. Kim, J. Y. Lee, and K. Y. Park, J. Polym. Sci. Part A, Polym. Chem., 31, 633 (1993).
4. H. Hojoji, O. Horie, M. Ogata, S. Numata, and N. Kinjo, Kobunshi Ronbunshu, 47, 483 (1990).
5. T. Shiraishi, H. Motobe, and M. Ochi, Polymer, 33, 2975 (1992).
6. S. P. Wilkinson, T. C. Ward, and J. E. McGrath, Polymer, 34, 870 (1993).
7. K. A. Barrett, M. A. Chaudhari, and B. H. Lee, SAMPE J., 25, 17 (1989).
8. H. D. Stenzenberger, M. Yamagiwa, K. Asagi, K. Kamio, and S. Kanagawa, 18th Int. SAMPE Tech. Conf., Anaheim, CA, 1986, p. 694.
9. S. Pierce, M. Canning, K. Fear, H. D. Stenzenberger, M. Herzog, W. Romer, and R. Scheiblich, Plastics, 36(9), 37 (1985).
10. W. G. Kim and T. Y. Nam, U.S. Pat. 5,189,082 and 5,266,612 (1993).
11. W. G. Kim, SAITEC, 2(2), 150 (1989).
12. M. R. Patel, Angew. Makromol. Chem., 102, 103 (1982).
13. D. J. Belton and E. Sullivan, J. Appl. Poly. Sci., 31, 1309 (1986).
14. R. W. Biernath and D. S. Soane, in Contemporary Topics in Polymer Science, Vol. 7, J. C. Salamone and J. Riffle (Eds.), Plenum Press, New York, 1992, pp. 103-159.
15. T. Enoki, H. Okubo, K. Ishii, and S. Shibahara, Thermosetting Resin, 12, 9 (1991).