Integrated magnetics on silicon for power supply in package (PSiP) and power supply on chip (PwrSoC)

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

Volumn , Issue , 2010, Pages

  Wang, Ningning ^a   Hannon, Jason ^b   Foley, Ray ^b   McCarthy, Kevin ^b   O'Donnell, Terence ^c   Rodgers, Kenneth ^a   Waldron, Finbarr ^a   Ó Mathúna, Cian ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

^b UNIVERSITY COLLEGE CORK   (Ireland)

^c ENTERPRISE IRELAND   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

AREA REDUCTION; DIGITAL PULSE WIDTH MODULATORS; EMBEDDED SUBSTRATES; INTEGRATED MAGNETICS; INTEGRATED POWER; KEY ELEMENTS; ON-CHIP CAPACITORS; PACKAGING TECHNIQUES; POWER IC; POWER SUPPLY; POWER SUPPLY-ON-CHIP; SI TECHNOLOGY; SYSTEM IN PACKAGE; SYSTEM ON CHIPS;

CHIP SCALE PACKAGES; DC-DC CONVERTERS; MICROPROCESSOR CHIPS; PACKAGING; TECHNOLOGY;

DC POWER TRANSMISSION;

EID: 78651298851     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2010.5642892     Document Type: Conference Paper

References (10)

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