SCOPUS 정보 검색 플랫폼

Volumn 651, Issue 2, 2011, Pages 233-236

Effect of multi-walled carbon nanotubes as second phase on the copper electrochemical reduction behavior for fabricating their nanostructured composite films

(4) Qin, Xiao Xin a Liu, Jing Jun a Wang, Feng a Ji, Jing a

a BEIJING UNIVERSITY OF CHEMICAL TECHNOLOGY (China)

Author keywords

Composite electrodeposition; Copper; Electrochemical formation mechanism; Multi walled carbon nanotube; Nanostructured films

Indexed keywords

CARBON FILMS; CARBON NANOTUBES; CATHODIC POLARIZATION; CHEMICAL SENSORS; COPPER; CRYSTAL GROWTH; CRYSTAL ORIENTATION; ELECTROCHEMICAL CORROSION; ELECTROLYTIC REDUCTION; ELECTROPLATING; FILM GROWTH; HYDROCHLORIC ACID; MULTIWALLED CARBON NANOTUBES (MWCN); NANOSTRUCTURED MATERIALS; PURIFICATION;

COMPOSITE ELECTRODEPOSITION; COPPER SULFATE; CU FILMS; ELECTROCHEMICAL FORMATION; ELECTROCHEMICAL IMPEDANCE SPECTRUM; ELECTROCHEMICAL REDUCTIONS; ELECTRODEPOSITED FILMS; ELECTRODEPOSITION PROCESS; MATRIX; NANO-STRUCTURED; NANOSTRUCTURED COMPOSITES; NANOSTRUCTURED FILMS; PLATING BATH; PULSE ELECTRODEPOSITION; SECOND PHASE; SPATIAL NETWORK;

COMPOSITE FILMS;

EID: 78651286257 PISSN: 15726657 EISSN: None Source Type: Journal
DOI: 10.1016/j.jelechem.2010.11.032 Document Type: Article

Times cited : (6)

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