Development and characterization of imidazole derivative cured bisphenol A epoxy materials for flip-chip underfill applications

Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn , Issue , 1999, Pages 317-324

  Shi, S H ^a,b   Yamashita, T ^a,b   Wong, C P ^a,b  

^a University of New South Wales   (Australia)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERIZATION; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRONICS PACKAGING; EPOXY RESINS; FLIP CHIP DEVICES; GLASS TRANSITION; INTERFACES (MATERIALS); PACKAGING MATERIALS; PHENOLS; THERMAL EXPANSION;

BISPHENOL A EPOXY RESIN; CROSS-LINKING DENSITY; DYNAMIC MECHANICAL ANALYZER; ELECTRONIC PACKAGING; GENERAL INFORMATION; IMIDAZOLE DERIVATIVES; TEMPERATURE RANGE; THERMOMECHANICAL ANALYZERS;

CURING;

EID: 78651276942     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1999.757332     Document Type: Conference Paper

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