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Volumn , Issue , 2010, Pages

Formation of mechanical strains in the component board of a high-end handheld product during shock impact

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC EXCITATION; BOARD LEVEL DROP TESTS; BOARD-LEVEL; COMPLETE PRODUCTS; CRITICAL COMPONENT; DROP TEST; ELECTRONIC COMPONENT; FUNDAMENTAL VIBRATIONS; HANDHELDS; KEY FACTORS; LOADING CONDITION; MECHANICAL DAMPING; MECHANICAL RESPONSE; MECHANICAL SHOCK; MECHANICAL STRAIN; MECHANICAL VIBRATIONS; PRODUCT-LEVEL TEST; STRAIN AMPLITUDE; TEST CASE;

EID: 78651273490     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2010.5642847     Document Type: Conference Paper
Times cited : (3)

References (8)
  • 1
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    • Lim, C.T.1    Low, Y.J.2
  • 2
    • 84964690874 scopus 로고    scopus 로고
    • Mechanical Response of PCBs in Portable Electronic Products during Drop Impact
    • IEEE
    • Seah S.K.W., Lim C.T., Wong, E.H., Tan, V.B.C. and Shim V.P.W.; "Mechanical Response of PCBs in Portable Electronic Products During Drop Impact", EPTC 2002, pp. 120-125, IEEE 2002
    • (2002) EPTC 2002 , pp. 120-125
    • Seah, S.K.W.1    Lim, C.T.2    Wong, E.H.3    Tan, V.B.C.4    Shim, V.P.W.5
  • 3
    • 0038690050 scopus 로고    scopus 로고
    • Drop Impact Survey of Portable Electronic Products
    • IEEE
    • Lim C.T., Ang C.W., Tan, L.B., Seah, S.K.W. and Wong, E.H.; "Drop Impact Survey of Portable Electronic Products", ECTC 2003, pp.113-120, IEEE 2003
    • (2003) ECTC 2003 , pp. 113-120
    • Lim, C.T.1    Ang, C.W.2    Tan, L.B.3    Seah, S.K.W.4    Wong, E.H.5
  • 4
    • 24644510375 scopus 로고    scopus 로고
    • Modal and Impact Analysis of Modern Portable Electronic Products
    • IEEE
    • Tan, L.B., Ang, C.W., Lim, C.T., Tan, V.B.C. and Xiaowu, Z; "Modal and Impact Analysis of Modern Portable Electronic Products", ECTC 2005, pp. 645-653, IEEE 2005
    • (2005) ECTC 2005 , pp. 645-653
    • Tan, L.B.1    Ang, C.W.2    Lim, C.T.3    Tan, V.B.C.4    Xiaowu, Z.5
  • 5
    • 84954042925 scopus 로고    scopus 로고
    • Comparison of Mechanical Response of PCBs Subjected to Product-Level and Board-Level Drop Impact Tests
    • IEEE
    • Ong Y.C., Shim, V.P.W., Chai, T.C. and Lim, C.T.; "Comparison of Mechanical Response of PCBs Subjected to Product-Level and Board-Level Drop Impact Tests", EPTC 2003, pp. 223-227, IEEE 2003
    • (2003) EPTC 2003 , pp. 223-227
    • Ong, Y.C.1    Shim, V.P.W.2    Chai, T.C.3    Lim, C.T.4
  • 6
    • 27644458797 scopus 로고    scopus 로고
    • Drop Impact Reliability Analysis of CSP Packages at Board and Product System Levels Through Modeling Approaches
    • IEEE
    • Zhu, L. and Marcinkiewicz, W; "Drop Impact Reliability Analysis of CSP Packages at Board and Product System Levels Through Modeling Approaches", IEEE Transactions on Components and Packaging Technologies, Vol. 28, No. 3, pp. 449-456, IEEE 2005
    • (2005) IEEE Transactions on Components and Packaging Technologies , vol.28 , Issue.3 , pp. 449-456
    • Zhu, L.1    Marcinkiewicz, W.2
  • 7
    • 33847151334 scopus 로고    scopus 로고
    • Analytical and Numerical Analysis of Drop Impact Behavior for a Portable Electronic Device
    • IEEE
    • Zhou, J., Kallolimath, S. and Lahoti, S.; "Analytical and Numerical Analysis of Drop Impact Behavior for a Portable Electronic Device", EuroSimE 2006, pp.1-7, IEEE 2006
    • (2006) EuroSimE 2006 , pp. 1-7
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.