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Volumn 2006, Issue , 2006, Pages

Analytical and numerical analysis of drop impact behavior for a portable electronic device

Author keywords

[No Author keywords available]

Indexed keywords

CELLULAR TELEPHONE SYSTEMS; DEGREES OF FREEDOM (MECHANICS); ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; HOUSING; MATHEMATICAL MODELS; SEMICONDUCTOR MATERIALS; STIFFNESS;

EID: 33847151334     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2006.1644050     Document Type: Conference Paper
Times cited : (8)

References (12)
  • 1
    • 0028485029 scopus 로고
    • Dynamic Response of a Rectangular Plate to a Shock Load, with application to Portable Electronic Product
    • Suhir E., "Dynamic Response of a Rectangular Plate to a Shock Load, with application to Portable Electronic Product," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol.17, No. 3, 1994.
    • (1994) IEEE Transactions on Components, Packaging and Manufacturing Technology , vol.17 , Issue.3
    • Suhir, E.1
  • 2
    • 0031362276 scopus 로고    scopus 로고
    • Is The Maximum Acceleration An Adequate Criterion Of The Dynamic Strength of a Structural Element in an Electronic Product?
    • December
    • Suhir E., "Is The Maximum Acceleration An Adequate Criterion Of The Dynamic Strength of a Structural Element in an Electronic Product?" IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. 20, No. 4, December 1997.
    • (1997) IEEE Transactions on Components, Packaging, and Manufacturing Technology , vol.20 , Issue.4
    • Suhir, E.1
  • 5
    • 24644446520 scopus 로고    scopus 로고
    • Effect of Impact pulse parameters on Consistency of the Board level Drop Test and Dynamic Responses
    • Luan J., and Tee T. Y., "Effect of Impact pulse parameters on Consistency of the Board level Drop Test and Dynamic Responses," Electronic Components Technology Conference, 2005.
    • (2005) Electronic Components Technology Conference
    • Luan, J.1    Tee, T.Y.2
  • 7
    • 2942723277 scopus 로고    scopus 로고
    • Drop Test and Impact Life Prediction Model for QFN Packages
    • Tee T Y., Ng H S, "Drop Test and Impact Life Prediction Model for QFN Packages," Journal of SMT, Vol. 16, No. 3, 2003.
    • (2003) Journal of SMT , vol.16 , Issue.3
    • Tee, T.Y.1    Ng, H.S.2
  • 9
    • 84954043857 scopus 로고    scopus 로고
    • Modal Analysis and Dynamic Response of Board Level Drop Test
    • Singapore, pp, December
    • Laun J., Tee T., Pek E., Lim C., and Zhong Z., "Modal Analysis and Dynamic Response of Board Level Drop Test", 5th EPTC conference, Singapore, pp. 233-243, December 2003.
    • (2003) 5th EPTC conference , pp. 233-243
    • Laun, J.1    Tee, T.2    Pek, E.3    Lim, C.4    Zhong, Z.5
  • 10
    • 27644458797 scopus 로고    scopus 로고
    • Drop Impact Reliability Analysis of CSP Packages at Board and Product Levels through Modeling Approaches
    • September
    • Zhu L., and Marcinkiewicz W., "Drop Impact Reliability Analysis of CSP Packages at Board and Product Levels through Modeling Approaches," IEEE Transactions on Component and Packaging Technologies, Vol.28, No.3, September 2005.
    • (2005) IEEE Transactions on Component and Packaging Technologies , vol.28 , Issue.3
    • Zhu, L.1    Marcinkiewicz, W.2
  • 11
    • 2942740958 scopus 로고    scopus 로고
    • Impact Life Prediction Modeling of TFBGA Packages under Board Level Drop Test
    • Tee, T. Y, Ng, H. S., Lim, C. T., Pet, E., and Zhong, Z. W., "Impact Life Prediction Modeling of TFBGA Packages under Board Level Drop Test", Microelectronics Reliability Journal, Vol. 44(7), pp.1131-1142. 2004.
    • (2004) Microelectronics Reliability Journal , vol.44 , Issue.7 , pp. 1131-1142
    • Tee, T.Y.1    Ng, H.S.2    Lim, C.T.3    Pet, E.4    Zhong, Z.W.5
  • 12
    • 33847164898 scopus 로고    scopus 로고
    • JEDEC Standard JESD22-B111-B, Board Level Drop Test Method of Components for Handheld Electronic Products, July 2003.
    • JEDEC Standard JESD22-B111-B, "Board Level Drop Test Method of Components for Handheld Electronic Products," July 2003.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.