Hot-embossing of microstructures on large area of polymers

Key Engineering Materials

Volumn 447 448, Issue , 2010, Pages 483-487

  Lin, Wei ^a   Chen, Wenjie ^a   Kiew, Choon Meng ^a   Ng, Chuen Leong ^a   Luo, Hong ^a   Teo, Chek Sing ^a   Yang, Guilin ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Hot embossing; Large area substrates; Nanoimprint lithography; Step and repeat

Indexed keywords

MACHINE DESIGN; MICROSTRUCTURE; NANOIMPRINT LITHOGRAPHY; PRECISION ENGINEERING;

ALIGNMENT MECHANISM; ELECTROPLATED NICKEL; HOT-EMBOSSING; LARGE-AREA SUBSTRATES; LINEAR DIMENSIONS; MASS PRODUCTION; PRECISION PROCESS; STEP-AND-REPEAT;

LITHOGRAPHY;

EID: 78650451457     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/KEM.447-448.483     Document Type: Conference Paper

References (4)

1. C.-H. Wu, C.-H. Lu, Fabrication of an LCD light guide plate using closed-die hot embossing, Journal of Micromechanics and Microengineering. Vol. 18 (2008).
2. M. Heckele, W.K. Schomburg, Review on micro molding of thermoplastic polymers, Journal of Micromechanics and Microengineering. Vol. 14 (2004).
3. H. Becker, U. Heim, Hot embossing as a method for the fabrication of polymer high aspect ratio structures, Sensor and Actuator A: Physical, Vol. 83, Issues 1-3, (2000) p. 130-135.
4. N. Roos, H. Schulz, L. Bendfeldt, M. Fink, K. Pfeiffer, H.-C. Scheer, First and second generation purely thermoset stamps for hot embossing, Microelectronic Engineering, 61-62 (2002), P. 299-405.