Investigation of argon nanocrystalline thermal conductivity by molecular dynamics simulation

Journal of Applied Physics

Volumn 108, Issue 10, 2010, Pages

  Ju, Shenghong ^a   Liang, Xingang ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

AVERAGE GRAIN SIZE; GRAIN INTERFACE; GREEN-KUBO; MD SIMULATION; MOLECULAR DYNAMICS SIMULATIONS; NANOCRYSTALLINE BULK; NANOCRYSTALLINES; PERIODIC CONFIGURATION; PHONON MEAN FREE PATH; POLYCRYSTALLINE; POLYCRYSTALLINE SOLID; POLYCRYSTALLINE STRUCTURE; SINGLE-CRYSTALLINE MATERIALS; THERMAL PROPERTIES; THERMAL RESISTANCE; VORONOI TESSELLATIONS;

ARGON; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MOLECULAR DYNAMICS; MOLECULAR MECHANICS; POLYCRYSTALLINE MATERIALS; POLYCRYSTALS; SINGLE CRYSTALS; THERMAL CONDUCTIVITY; THERMODYNAMIC PROPERTIES; THREE DIMENSIONAL COMPUTER GRAPHICS;

THERMAL CONDUCTIVITY OF SOLIDS;

EID: 78650296809     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3510523     Document Type: Conference Paper

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