Solder jet technology update

International Journal of Microcircuits and Electronic Packaging

Volumn 21, Issue 1, 1998, Pages 73-77

  Wallace, David B ^a   Hayes, Donald J ^a  

^a MICROFAB TECHNOLOGIES INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; INTEGRATED CIRCUITS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT DESIGN; SOLDERING;

CHIP SCALE PACKAGES; SOLDER BUMPS; SOLDER JET TECHNOLOGY; WAFER BUMPING;

ELECTRONICS PACKAGING;

EID: 0032010297     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)