Hot deformation behavior of Cu-8.0Ni-1.8Si-0.15Mg alloy

Materials Science and Engineering: A

Volumn 528, Issue 3, 2011, Pages 1641-1647

  Zhang, L ^a   Li, Z ^a   Lei, Q ^a   Qiu, W T ^a   Luo, H T ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

Cu Ni Si alloy; Deformation; Recrystallization; Stress strain

Indexed keywords

ACTIVATION ENERGY; COPPER ALLOYS; DYNAMIC RECRYSTALLIZATION; MAGNESIUM ALLOYS; SILICON ALLOYS; STRAIN RATE;

DEFORMATION TEMPERATURES; DYNAMIC RECOVERY; DYNAMIC RECRYSTALLISATION; GLEEBLE; HOT DEFORMATION BEHAVIORS; MICROSTRUCTURE EVOLUTIONS; RECRYSTALLISATION; STRAIN-RATES; STRESS/STRAIN; THERMAL DEFORMATION ACTIVATION ENERGY;

NICKEL ALLOYS;

EID: 78650174047     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2010.10.103     Document Type: Article

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