Improvement in strength and electrical conductivity of Cu-Ni-Si alloys by aging and cold rolling

Journal of Alloys and Compounds

Volumn 417, Issue 1-2, 2006, Pages 116-120

  Suzuki, S ^a   Shibutani, N ^a   Mimura, K ^a   Isshiki, M ^a   Waseda, Y ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

Aging; Copper base alloy; Electrical conductivity; Electrical resistivity; Hardness; Rolling; Strength

Indexed keywords

AGING OF MATERIALS; ELECTRIC RESISTANCE; NICKEL ALLOYS; ROLLING; SILICON; VICKERS HARDNESS TESTING;

COLD-ROLLED ALLOYS; COPPER BASE ALLOY; STRENGTH;

COPPER ALLOYS;

EID: 33646863196     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2005.09.037     Document Type: Article

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