The evolution of microstructure in Cu-8.0Ni-1.8Si-0.15Mg alloy during aging

Materials Science and Engineering: A

Volumn 527, Issue 24-25, 2010, Pages 6728-6733

  Lei, Q ^a   Li, Z ^a,b   Wang, M P ^a,b   Zhang, L ^a   Xiao, Z ^c   Jia, Y L ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

^b BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS   (China)

^c UNIVERSITY OF LIVERPOOL   (United Kingdom)

Author keywords

Cu Ni Si alloy; Microstructure; Ordering; Precipitation; Spinodal decomposition

Indexed keywords

COPPER ALLOYS; ELECTRIC CONDUCTIVITY; HIGH STRENGTH ALLOYS; MAGNESIUM ALLOYS; MICROHARDNESS; NICKEL ALLOYS; PRECIPITATION (CHEMICAL); SILICON ALLOYS; SPINODAL DECOMPOSITION; TENSILE STRENGTH; TRANSMISSION ELECTRON MICROSCOPY;

AGING TIME; DECOMPOSITION ORDER; HIGH ELECTRICAL CONDUCTIVITY; MATRIX; MULTIPLE INTERACTIONS; ORDERING; PHASES TRANSFORMATION; SELECTED AREA ELECTRONIC DIFFRACTION; SUPER HIGH STRENGTH; TRANSMISSION ELECTRON;

MICROSTRUCTURE;

EID: 77956011208     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2010.07.023     Document Type: Article

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